CyberOptics Corporation (Nasdaq: CYBE) will showcase its latest, award-winning SE500ULTRA SPI system and QX600 AOI system in booth #323, Hall 6 at the SMT Hybrid Packaging exhibition and conference which is scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

The QX600 AOI System comes with an all-new Strobed Inspection Module (SIM) with enhanced illumination delivering the best 01005 and solder joint inspection ever. The SIM is engineered to be absolutely calibration-free and illuminates only when necessary, reducing cost of ownership. As illumination needs differ for various component types, we design our systems with flexible illumination providing a combination of lighting contrasts to suit different inspection types. A higher sensor resolution (12 micro;m) captures brilliant and crisp quality images for accurate inspection of a wide variety of features including 01005 components.

The SE500ULTRA system is power-packed with 30 percent more speed, revamped defect review software and optional dual illumination sensor. An all-new, improved ultra-fast sensor combined with a unique all-in-one scan technique (that combines fiducial, barcode and range scans into one, seamless inspection scan sequence) is what makes the SE500ULTRA 30 percent faster at 210 cm2/sec. The optional Dual Illumination sensor further enhances repeatability and reproducibility on the very smallest of paste deposits. The SE500ULTRA is closed-loop feedback ready enabling optimized printing process and improved yields.

Visit the CyberOptics team in booth #323 during SMT Hybrid Packaging 2013 to find out more about these leading-edge inspection solutions.

For more information, please visit www.cyberoptics.com.