AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA.

This low-cost, lead-free, halogen-free solder paste offers the performance of tin-lead and high-silver lead-free solder pastes. Now manufacturers can attain the SMT soldering results they require while paying significantly less per gram than with traditional lead-free solder pastes. NC259 provides excellent print definition and sustainable solder volume transfer as the demand for smaller pads grows. Proven to mitigate head-in-pillow defects, NC259 reduces rework and rejected board costs to the manufacturer.

NC259 is formulated to provide one of the longest pause-to-print windows in the industry, resulting in less solder waste, fewer restart costs and improved overall quality of prints. The long stencil life and shelf-life results in far less waste than traditional solder pastes. The extremely broad process window of NC259 allows assemblers with high-density, high mix boards to run without timely set up. NC259 also offers extremely low post-process residues, which remain crystal clear after soldering.

Additionally, AIM will highlight its liquid fluxes, tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin, copper, and a small amount of nickel + germanium.

To discover all of AIMs products, including lead-free and halogen-free solder, visit the company in booth #1302 at the IPC APEX Expo or visit www.aimsolder.com.