Test Research, Inc. (TRI) a leading test and inspection systems provider for the electronics manufacturing industry will feature its complete PCBA test and inspection portfolio and premiere latest 3D AOI, AXI and SPI systems at the upcoming NEPCON China 2013 exhibition. Visit us at booth 1G73 at Shanghai World EXPO Convention Center from April 23 through April 25 for a personal tour.

The highlights of TRIs 2013 portfolio include TR7730 3D Automated Optical Inspection (AOI) and worlds fastest multi-phase AOI, the TR7700 SIII. Featured products will include several award winners, including 2013 Best in Test TR7007 SII 3D SPI system introducing a new touch-screen driven GUI with 5-step easy programming, and 2012 Best in Test TR5001 TINY In-circuit Tester with TR7600 SII 3D Automated X-ray Inspection (AXI).

Commenting on this years lineup at NEPCON China, TRIs VP of Sales and Marketing Jim Lin emphasized, TRI focuses on delivering maximum value to our customers by combining integrated solutions with innovative technology and worldwide support. NEPCON China remains a key event for TRI to demonstrate our unmatched portfolio of test and inspection solutions to potential customers from Greater China and around the world.

Discover how TRIs complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRIs systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at booth 1G73 for a personal tour of TRIs solution lineup.