Engineered Material Systems, Inc. (EMS), a leading global supplier of electronic materials for circuit assembly applications, debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.

535-18M-57 is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. The material is designed to eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

This new nonconductive UV cured adhesive cures rapidly when exposed to high-intensity UV light. 535-18M-57 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.

EMS 535-18M-57 UV Cure Adhesive was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. 535-18M-57 is the latest addition to Engineered Material Systems extensive line of electronic materials.

For more information about the 535-18M-57 UV Cure Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visitwww.emsadhesives.com.