FCT Assembly announces that Field Application Engineer Tony Lentz will present at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 10, 2013 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD. Lentz will present, Can Nano Coatings Really Improve Stencil Performance?

Nano coatings have been introduced by various manufacturers with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include reduced underside cleaning, reduced bridging, improved solder paste release and improvements in yield. With several nano technologies already on the market and more likely to be introduced, Lentz will address the following questions: How can the performance be quantified?; How robust are these coatings?; How can an assembler approach the ROI of these coatings?; and What hidden benefits or negative impacts should be considered?

Lentz has been in the electronics industry since 1994, and worked as a process engineer at a circuit board manufacturer for five years. He has extensive experience performing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Additionally, Lentz has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in chemistry.

For more information, visit www.fctassembly.com.