Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry will showcase its award winning complete PCBA test and inspection portfolio featuring the latest 3D AOI, AXI and SPI systems with innovative ICT products at the upcoming SMTA International 2013 exhibition. Visit TRIs booth #420 at Fort Worth Convention Center, TX from October 15- 16 for a personal tour of TRIs latest inspection and testing technologies.

TRIs vice president of sales and marketing Jim Lin commented on the occasion, Were proud to bring our complete inspection portfolio to SMTA in a great opportunity to demonstrate the value our award-winning and production-tested systems can bring our partners every day.

Presenting a complete solution for the PCBA production line, TRI will exhibit the 2013 Best in Test Award-winning TR7007 SII SPI, along with 2D + 3D AOI solution TR7730 and industrys favorite ICT TR5001 Inline. Specializing on post-reflow inspection, the TR7550 SII AOI offers complete coverage including conformal coating inspection using UV/visible lighting and multi-angle cameras. Award-winning TR7600 SII 3D AXI completes the inspection coverage of hidden defects for shielded assemblies, BGA and PoP ICs and thru-hole connector joints.

TRIs new generation portable ICT, the TR5001T SII TINY offers even higher performance, Boundary Scan coverage and advanced functional testing in a package with unprecedented mobility and exceptional value.

Visit us at SMTAI 2013 in October to find out how much value can our solutions bring to your production line.