Essemtec AG presents its new SMT production centre for the first time at productronica in Munich. Jetting of solder paste instead of printing saves costs for stencils and enhances the production flexibility especially for lower to midsize volumes. Until today, separate machines have to be bought to fulfil this requirement. Essemtec is merging its dispensing and pick-and-place know how of the Scorpion and Paraquda machines into an SMT production centre that will be on display at Essemtecs booth in hall A3, booth 341.

High productivity

Jet printing is faster (up to 80000 dots/h) and more precise than any other dispensing system for solder pastes. So far, jetting of pastes has only been possible with specially designed, costly solder pastes. The new system from Essemtec opens the range of pastes to most type 4, 5, 6 or 7 pastes.

The combination of jet printing with pick-and-place

eliminates the need to program two different machines and reduces the investment costs dramatically. Set up is done directly from CAD data using an integrated paste library. Production is fully automated and the application of solder paste and the placement of components are seamlessly integrated while process monitoring ensures high quality results.

Quick return on investment

The return on investment of the Jet Printing option is achieved approximately within 150 - 200 stencils and even fasters if the products require stepped stencils. For higher throughput, the Jet Printing option can also be installed on the multiple module Production Centre Paradoble which will also premier at productronica at Essemtecs booth in hall A3, booth 341.