Test Research, Inc. (TRI) is bringing a full line up of PCBA test and inspection systems to the Tokyo Big Sight to exhibit at NEPCON Japan 2014. Featured in booth EAST 25-20, the 2013 Best in Test Award-winning SPI system and the 2013 EM Asia Innovation Award winner ICT will be on display alongside TRIs latest AOI, ICT and AXI systems from January 15-17, 2014.

3D AOI: TR7500 SIII 3D

Showcased for the first time in Japan, TRIs TR7500 SIII 3D AOI system delivers Total Inspection Coverage by combining true 3D profile measurement with TRIs high performance multi-angle 2D inspection. The universal inspection system with a new generation programming UI makes testing complex automotive and high density assemblies a breeze.

*2013 Best in Test Winner: TR7007 SII Solder Paste Inspection System

The TR7007 SII 3D Solder Paste Inspection (SPI) is the industrys fastest inline shadow-free SPI system, offering highly accurate inspection at top scan speed of 200 cm/sec at 15 m. For the first time in Japan, TRI will also introduce a redesigned GUI for its TR7007 series SPI systems featuring rapid 5-step program development and offline fine-tuning capability.

*2013 EM Asia Innovation Award Winner: TR5001T SII TINY In-Circuit Test System

New generation of the smallest and most powerful TINY in-circuit test system expands its impressive performance with Boundary Scan and a Parallel Testing option. The wide range of MDA, ICT and functional testing options make TR5001T SII TINY the first choice for a cost-effective ICT system.

3D AXI: TR7600X SII AXI

TR7600X SII high performance 3D AXI combines TRIs digital tomosynthesis technology and innovative software for inspection of 0201 and 01005 components. TRIs Block Scan delivers exceptional 3D slice clarity in microBGA, PoP, HIP defect and Press-fit inspection in a single pass for high testing efficiency and speed.

Rounding up the full range of inspection and testing systems are TR5001 INLINE ICT and third generation AOI system, TR7700 SIII with multi-phase inspection and innovative programming interface for best inspection accuracy.

Visit us at booth EAST 25-20 during NEPCON Japan 2014 to view product demos and learn how TRI systems can meet your specific board test and inspection requirements!

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at www.tri.com.tw. For sales and service information, write us at sales@tri.com.tw or call +886-2-2832-8918.