FCT Assembly is pleased to announce that it now offers a variety of anti-tombstoning solder pastes as an option with each of its solder paste fluxes. The anti-tombstoning solder pastes present an excellent way to reduce the potential for tombstoning.

Tombstoning occurs when components lift up during reflow causing an open pad at one end. This typically occurs when one solder paste deposit reflows before the other. Tombstoning is commonly found on circuit boards that have a ground plane attached to one end of a small component. This creates a temperature difference from end-to-end of the component during reflow.

FCTs new anti-tombstoning solder pastes are ideal for use when it is difficult to change the reflow profile. FCT achieves anti-tombstoning properties through modification of the alloy to introduce a melting range. This equalizes wetting forces, which prevent small components from tombstoning. The pastes feature excellent performance when tombstoning is a concern and excellent wetting characteristics on all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn and Ag. Additionally, the pastes are available in no-clean and water soluble as well as lead-free and leaded formulations.

For more information about FCT Assemblys Anti-Tombstoning formulation, visit http://www.fctassembly.com/tombstoning.php. To download a Technical Data Sheet, visit http://www.fctassembly.com/tds.php.