CyberOptics Corporation (Nasdaq: CYBE) announces that it will display its award-winning SPI and AOI inspection solutions in Booth E127 at SMT/PCB NEPCON Korea, scheduled to take place April 2-4, 2014 at the Coex Convention Exhibition Center in Seoul, South Korea.

The supreme SE600 3D SPI system delivers true volume measurement and sets a new bar for accurate solder paste measurements. This, combined with world-class usability, makes it the ideal inspection solution for automotive, medical, military and other top niche markets. Designed with a state-of-the-art dual illumination sensor, the system offers the best repeatability and reproducibility even on the smallest paste deposits. The award-winning SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection.

The QX600 ultra-fast, ultra-versatile AOI system powered by AI2 (Autonomous Image Interpretation) technology enables production-ready capability in less than 13 minutes. An all-new 80 Megapixel sensor delivers the best 01005 and solder joint inspection while capturing perfect quality images for accurate defect review.

QX100i offers high value, flexible AOI inspection and is an ideal solution for pre-reflow inspection and selective solder applications. Also on display will be the QX100 tabletop AOI system with true, inline performance. All CyberOptics AOI systems are powered by AI2, providing the power to inspect ANYTHING without having to anticipate defects or predefine variance. AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example. All this means lowest false calls, zero escapes and minimal tuning.