Test Research, Inc. (TRI) a leading test and inspection systems provider for the electronics manufacturing industry will feature its complete PCBA test and inspection portfolio and premiere latest 3D AOI, AXI and SPI systems at the upcoming NEPCON China 2014 exhibition. Visit us at booth B-1G40 at Shanghai World EXPO Convention Center from April 23 through April 25 for a personal tour.

The highlights of TRIs 2014 portfolio include TR7500 SIII 3D Automated Optical Inspection (AOI) and worlds fastest multi-phase AOI, the TR7700 SIII. Featured products will include TR7007 SII Plus 3D SPI system with 5-step easy programming, and the next generation of the worlds most powerful tiny ICT, TR5001T SII TINY In-circuit Tester with TR7600LL SII 3D Automated X-ray Inspection (AXI) for extra-large PCB assemblies. Special attention will also go to TRIs new inline ICT and MDA systems designed to fit all production line requirements.

Commenting on this years lineup at NEPCON China, TRIs VP of Sales and Marketing Jim Lin emphasized, TRI focuses on delivering maximum value and savings to our customers by combining intelligent, integrated solutions with innovative technology and a worldwide support network. NEPCON China is one of TRIs key events in 2014 and were ready to demonstrate our unmatched portfolio of test and inspection solutions to potential customers from Greater China and around the world.

Discover how TRIs complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRIs systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at booth B-1G40 for a personal tour of TRIs solution lineup.