With more than 2,000 installations PARMI, a world leader in 3-dimensional inspection of printed solder paste on PCBs, announces that it has been awarded a 2014 NPI Award in the category ofTestInspection

SPI for its SIGMA X series solder paste inspection system. The award was presented to the company during a Tuesday, March 25, 2014 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO. This is the second consecutive year that PARMI won for Test Inspection

SPI. PARMIs SIGMA X Series is a next generation in-line solder paste inspection system. The system features a number of differentiating features including measuring speed of 100cm2/second at 10m x 10m resolution and the revolutionary Printer Doctor. Printer Doctor technology automatically analyzes SPI data in real-time, correlates paste deposition to printer activities, monitors trend change, alerts operators to process issues and provides the operator with user defined corrective action. The system monitors a number of screen printer activities including board support tooling, squeegee blade condition, edge clamp condition, paste readiness to print, triggers stencil wiping and others. Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

The SIGMA X inspects pads smaller than 01005 and sizes as small as 100m. The SIGMA X inspection is the fastest in the industry with its development of the RSC-7 sensor. For more information, visit www.parmi.com.