Essemtec,theSwissmanufacturerofproductionsystemsforelectronicassemblyandpackaging,announcesthatithasbeenawardeda2014NPIAwardinthecategoryofComponentPlacementndash;Multi-functionforitsmulti-functionalSMTCenter.TheawardwaspresentedtothecompanyduringaTuesday,March25,2014ceremonythattookplaceattheMandalayBayConventionCenterduringtheIPCAPEXEXPO.EssemtecisthefirstmanufacturerthatdevelopedacombinedSMTproductioncenterthatisabletojetsolderpasteandmountcomponentsinonemachine.

Themulti-functionalSMTcenterParaqudameetsalltherequirementsofamodern,highlyflexibleproductionsystem-changeoverwithoutdowntime,componentmanagement,andtheintegrationofjetprintingofsolderpasteorglue.Paraqudacombinestwodifferentproductionstepswithinonemachineplatform(solderpastejettingandSMDassembly).Withthisuniquecombination,themultifunctionalcenterallowsanunprecedentedflexibilityinthemarket.

Essemtecrsquo;ssolderjetprinterisfast(upto80,000dots/hr),veryprecise(51micro;m@3sigma;)andsuitablefor0201components.Sofar,jettingofsolderpasteswaspossibleonlywithlimitationsndash;electronicsmanufacturersneededtobuyspeciallydesigned,costlysolderpastes.ThenewsystemfromEssemtecopenstherangeofpastestomosttype4,5,6or7pastes.Essemtecrsquo;ssolderpastejetvalvecanbeinstalledonexistingmachinesplatforms,suchastheScorpionhigh-speedjetdispenserortheParaqudacomponentplacer.Productionisfullyautomated,andsolderpasteapplicationandcomponentplacementareseamlesslyintegratedwhileprocessmonitoringensureshigh-qualityresults.

Premieringin2008,theNPIAwardsprogramisanannualcelebrationofproductexcellenceinelectronicssurfacemountassembly.Premierproductsbasedonthefinestexamplesofcreativeadvancementintechnologyarechosenbyadistinguishedpanelofindustryexperts.

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