Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, today announced the release of its new RS-600 Six Zone Air and Nitrogen Reflow Ovens. The new model will greatly assist Juki in promoting its Total Line Solutions sales strategy into LED and OEM accounts.

The RS-600 reflow ovens offer the same feature set as the larger 8- and 10-zone ovens, such as; a top and bottom Independent Air Velocity Controlling System that allows for flexible processing control to easily handle complicated lead-free soldering requirements, a four way air recycling system in each zone, and an efficient power design and air management system that greatly improves energy savings while lowering carbon emissions. In addition, as with the larger ovens, the 6-zone oven has

Indium Corporation公司的Indium10.1锡膏是含卤素无铅锡膏，焊接QFN封装、BGA封装以及大接地焊盘时，产生的空洞极少。

Indium10.1有抑制氧化的作用，在阻止空洞和葡萄球现象方面处于行业领先水平，焊接时能够完全融合，即使是经过长时间的回流。 Indium10.1的焊接能力极好，对于可焊性并不理想的元件和很难焊接的RF金属屏蔽，是最佳选择。

Indium10.1在印刷和焊接的合格率方面对性能作了全面平衡，因而印刷电路板组装商能把成本降到最低。它的各方面特性均衡，而印刷性能和焊接性能则是最好的。在印刷清晰度和转移效率、减少空洞和防止枕窝和葡萄球现象方面，Indium10.1在行业领先。

Indium10.1锡膏是Indium Corporation的高性能无铅锡膏产品系列的一员。该系列提供多方面的特性，针对每一种具体的制造过程对锡膏的特性做了适当的平衡。该系列产品的每种锡膏都对印刷性能作优化，减少了个人电子产品制造商遇到的各种常见缺陷，例如QFN的空洞、枕窝、葡萄球现象。

有关Indium10.1或无铅锡膏系列的更多信息，请访问www.indium.com/solder-paste-and-powders/leading-pb-free-solder-pastes，或者发电子邮件到askus@indium.com。

Indium Corporation是世界上最杰出的材料制造商及供应商，为全球电子、半导体、太阳能、薄膜和热管理市场提供各种材料。它的产品包括焊料和助焊剂等焊接材料；导热界面材料；溅射靶材；铟、镓、锗、锡等金属和无机化合物；以及NanoFoil。Indium Corporation成立于1934年，在中国、新加坡、韩国、英国和美国设有全球技术支持机构和制造工厂。

有关Indium Corporation的更多信息，请访问网站www.indium.com或发电子邮件到abrown@indium.com。

a total heated length very similar to other ovens that are 7-, 8-, and even 9-zones.As an added benefit, Juki is now including KIC AFP (Auto-Focus Power) as a standard feature on its line of reflow ovens. AFP gives the Best First Guess when setting up a new product. To set up the Juki oven for a new PCB, the technician simply inputs the PCB length, width, and weight and the AFP software will take it from there by using a built in library of profiles and oven specifications. Once the information is provided AFP will suggest a recipe for the new PCB, reducing the need for profiling new products thus saving time and money. The suggested oven recipe seeks to put the PCB profile in the sweet spot of the process. In addition, the oven settings can lead to lower electricity use. It does not matter which profiler you are already using but it is possible to grow the library using a KIC profiler (X5, SlimKIC 2000 and KIC Explorer). Juki is now a reseller for KIC products.

For more information about Juki Automation Systems, visit www.jukiamericas.com.