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TRI在硅谷举办US技术研讨会
点击:1397来源: fbe-china.com作者:Kenny Fu
时间:2019-11-19 22:32:54

Test Research, Inc. (TRI) will host a US technology seminar on June 26, 2014 at Hotel Biltmore in Santa Clara, CA. The one day event will introduce recent technological innovations in the industrys only comprehensive PCBA testing and inspection solution portfolio and highlight the value TRIs award winning systems can provide to manufacturers in terms of lower capital costs , industry-leading performance and world class service.

The agenda will focus on new developments in 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI), and concluded with a session on TRIs 3D AXI systems and a complete range of board testing solutions, including inline and desktop ICT with on-site product demonstrations.

To register for the event, please contact Ms. The agenda and online registration are available on TRI website.

We look forward to seeing you in Santa Clara!

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements.

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