STI Electronics, Inc. announces that it will exhibit in Booth at the Space  Missile Defense (SMD) Symposium, scheduled to take place August 11-14 at the Von Braun Center in Huntsville, AL. Company representatives will discuss STIs manufacturing, material failure analysis and microelectronics capabilities. STIs Engineering Services division provides engineering support and specialized contract manufacturing services for the electronics manufacturing industry.

The Prototype and Manufacturing Lab is a full service design review and production facility. This laboratorys precise surface mount assembly line compliments the hand assembly line, including Automated Optical Inspection (AOI), and allows for expeditious and defect-free production of new and redesigned electronics hardware. Services include component procurement, assembly profile establishment, and manufacturability analysis as well as small volume production.

STIs Microelectronics Lab was established to meet the rising need for advanced systems development and assembly. Advanced design and modeling software enables STI to develop highly integrated hardware to meet shrinking form and fit factor requirements as well as increasing thermal loads. Emerging packaging materials are continuously evaluated to optimize electrical and thermal performance. The microelectronics lab specializes in state-of-the-art engineering design including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as Imbedded Component/Die Technology (IC/DT).

The Material Failure Analysis Laboratory offers enhanced capabilities that are a result of the recent addition of several new analytical tools and equipment. The analytical equipment includes some of the industry newest and most advanced tools.