Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Mr. Louis Lin, Applications Manager China Region, will present at the IPC Southeast Asia High Reliability Conference scheduled to take place August 20, 2014 at the Eastin Hotel in Penang, Malaysia. This paper is a result of extensive collaboration between DAGE and the Flextronics engineering teams in China and the US. Various failure analysis methods using X-ray computer tomography techniques are discussed in detail and compared.

Solderability and reliability have never been more critical than in todays production environment as components get smaller and demand for high reliability products increases. IPC has brought together an international panel of experts for this inaugural conference in the heart of Southeast Asia. Topics to be discussed include critical areas of the assembly process, and how design and materials choices will affect cost, reliability and turnaround time.

This important one-day event will focus on practical methodologies that can be deployed today critical information for staff and managers responsible for reliability. Industry experts representing every market sector will discuss solder technology, cleaning and test and inspection strategies. Focused presentations will address the following topics:

Strategic reliability considerations related to solder alloys and the latest packaging technologies

Issues such as void formation and electrochemical migration

Risk mitigation processes and data analysis

For more information about Nordson DAGE, visit www.nordsondage.com.