Duluth, GA, August 2014 Viscom announced today that its Business Development Manager, Jacques L Heureux, will present the paper titled Highly Accurate 3D Solder Paste Inspection Comparing Nano Coated Stencils with Non-Coated Results at the upcoming SMTA International exhibition. The presentation will be held during Session PRC2, titled Advances in Production Inspection Methods, and will take place Tuesday, Sept. 30, 2014 from 4-5:30 p.m. in Room 51 at the Donald Stephens Convention Center in Rosemont, IL. The paper was co-authored by Carsten Salewski, Viscom s President.  Manufacturing the latest electronic designs requires printing ever smaller deposits of solder paste. Once a critical stencil aperture aspect ratio is reached, other means of improving transfer efficiency (TE) must be investigated. A design of experiments was performed to show the effect of stencil nano-coatings on paste volumes and underscreen cleaning intervals. The key to making this type of study possible is having access to a very accurate and repeatable 3D SPI system. Improvements to the TE and longer underscreen cleaning intervals were realized with the nano-coated stencil. Process monitoring tools including 3D SPI make it possible for new technologies, like nano-coatings and solder paste improvements, to be easily and accurately analyzed and validated. L Heureux worked for 25 years in the automotive electronics industry before joining Viscom in January as its Business Development Manager for the Americas. His experience spans SMT process development, manufacturing engineering and global project management for inspection technologies. His current responsibilities include sales and global key account management for computer, consumer  communications, OEM and EMS.