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Vi TECHNOLOGY携最先进的检测技术亮相SMTAI​
点击:9084来源: fbe-china.com作者:Kenny Fu
时间:2019-11-15 12:26:47

Vi TECHNOLOGY, a provider of state-of-the-art inspection systems for the SMT industry, announces that it will exhibit in Booth #319 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the Pi SPI system, Sigma Review Software and 5K Spectro AOI system.

Pi is innovative, intelligent and intuitive, and allows the customer to see and measure the print process like never before. With 360 Moir technology, Pi is the first SPI to use angle cameras to measure the solder paste deposit. Taking about 352 images per field of view, and thanks to the amazingly powerful computing system (100 times more computing power than conventional solutions), Pi provides an ultra large image in 3D true color. It offers a large PCB capability (up to 533 x 600mms) within a very small envelope (only 800mms wide), responding to the increasing constraints on floor space in modern SMD lines.

Also on display, the 5K 3D Selective (AOI) combines state-of-the-art 2D inspection with a 3D option to check coplanarity issues on BGAs, QFNs, QFPs, connectors or larger components. For 95 percent of component inspection, 2D is more than enough. The use of 3D should be very selective and applied only when needed. With the 5K 3D Selective system, 3D measurement is just one click away. Additionally, the system is upgradable on most of the latest AOI systems.

Sigma Review (3P review) is a new multi-process review software. The software allows the user, when he checks the products at post-reflow inspection, to access information from the post-print inspection or post placement inspection. This provides valuable information about the process as the user can check if the defect caught post-reflow is caused by the print process or not (all pictures and data are stored even for good print processes). Thus, if needed, the user can adjust his print process inspection (tolerances) in order to catch defects at that stage (more costly effective solution).


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