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STI Electronics将携一条龙制造​合同和培训服务出席SMTAI​
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时间:2019-11-15 12:28:14

STI Electronics, Inc., a full service organization providing training services, analytical and failure analysis, prototyping, and small- to medium-volume PCB assembly, announces that it will exhibit in Booth at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will discuss STIs Engineering Services and Training Services divisions.

STIs Engineering Services division provides engineering support and specialized contract manufacturing services for the electronics manufacturing industry. From product design and manufacturability analysis to pre-production prototype and development, STIs Prototype and Development Lab is a full-service design review and preproduction facility. STIs Microelectronics Lab was established to meet the rising need for advanced systems development and assembly. The Microelectronics Lab specializes in state-of-the-art engineering design including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as Imbedded Component/Die Technology (IC/DT).s Training Services division develops customized training courses to fit specific training needs. Typically, STI builds these classes around company-specific standards and specifications. STI is an IPC authorized training center for J-STD-001, IPC-A-610, IPC/WHMA-A-620, IPC-A-600 and IPC7711/7721, and provides both Certified IPC Application Specialist (CIS) and Certified IPC Trainer (CIT) courses. Other courses include basic soldering, wave soldering, ESD training, BGA rework and many more. It also provides operator/inspector training for through-hole and SMT soldering, conformal coating, and cable harness to NASA-STD-8739.1, .2, .3 and .4 for Marshall Space Flight Center and its support contractors. In addition to its standardized training program support materials, STI Electronics Training Materials division provides unique or custom training materials ranging from chip scale and BGA to through-hole and terminal attachments.

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