Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) will debut the FX-940 AOI In-line PCB inspection system in Booth at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

The new Nordson YESTECH FX-940 offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co-planarity of chips, BGAs and other height sensitive devices. Offering advanced Fusion Lighting and a comprehensive set of inspection tools, including angled cameras, 3D height sensors, full color digital image processing, and both image- and rule-based algorithms, the FX-940 is unsurpassed in defect detection.

With Nordson YESTECHs advanced capture-on-the-fly imaging technology, the system offers high-speed inspection at over 30 sq. inches per second or greater than 1.5 million components per hour. With one top-down viewing camera and four side-viewing cameras, the FX-940 provides full inspection and traceability capabilities at todays fastest line speeds. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield management solution.