PARMI, a leader in 3-D solder paste inspection (SPI) of printed circuit boards announces the Jet Solder Jet Dispenser Unit for its award-winning SIGMA X SPI Series. Jet repairs solder paste deposits within the machine to eliminate expensive rework and scrap, maximizes throughput and increases ROI.

Jet follows the recent introduction of PARMIs exclusive Printer Doctor feature, which automatically analyzes solder paste inspection data in real time, correlates it to printing activities and provides user-defined corrective action. Insufficient or missing solder paste is a common process symptom, says Jeff Mogensen, GM at PARMI. SIGMA X now eliminates the re-work and scrap associated with them by repairing them in the SPI machine. This time-saving feature significantly improves yields and ultimately profitability, Mogensen adds. With more than 2,500 installations worldwide, PARMI leads the industry in SPI performance and innovation. The companys SPI products have won the New Product Introduction Award two years running from the prestigious Circuits Assembly organization in recognition of product excellence in the field of electronics surface mount assembly. PARMI and our SIGMA X Series is the benchmark in solder paste inspection, says Mogensen, and we are pleased to showcase the Jet Solder Jet Dispenser Unit as further proof of our commitment to innovation and value-added product development.