FCT Assembly today announced plans to exhibit at the SMTA Capital Expo Tech Forum, scheduled to take place Tuesday, September 9, 2014 at the John Hopkins University/Applied Physics Lab in Laurel, MD. Solder experts Rodney Wade and Dinesh Patel will be available to discuss FCTs line of solution driven solder pastes.

FCT Assembly offers solder pastes that are specially formulated to solve various issues during the assembly process, including anti-tombstoning, low graping, low voiding, low melting, high activity and more. The product line is separated into leaded versus lead-free. For leaded pastes, FCT sells 63/37, 62/36/2 and high temperature leaded alloys. Lead-free alloys include SAC305, SN100C, SAC387, SAC307 as well as other HMP alloys. These typically come in Type 3, Type 4 and Type 5 particle sizes.

FCT Assembly is more than a manufacturer and supplier; the company is an extension of its customers engineering department. FCT has numerous resources that allow the company to support its customers production process on a technical level. FCTs technical experts offer technical support for solder paste, SMT stencils, reflow profiling, root cause analysis and many other phases during the SMT process.In addition to its line of solder paste, FCT manufactures other products that reduce defects and increase yields during the printing process including laser cut stencils and stencil coatings. Visit the FCT team at the SMTA Capital Expo or go to www.fctassembly.com to find out why FCT has the best performing products on the market.