Test Research, Inc. (TRI) premiered its 3D AOI and closed loop SPI solution during a successful educational VIP seminar in Sao Paulo, Brazil on August 20-21. Hosted in cooperation with TRIs exclusive partner Teknosip, the two day event saw over 250 industry leaders and engineers attend sessions on Electronics Manufacturing, Market Development and future applications, followed by expert courses on solder paste printing and inspection, and concluded with application notes on component placement and 3D AOI.

TRIs TR7500 SIII 3D is the first 3D AOI platform introduced to the Brazilian market and received an overwhelming response from both managers and engineers attending the seminar. Together with a comprehensive study of closed loop SPI advantages, the technology sessions offered a unique opportunity for all attendees to study a real production line environment with expert engineers at hand.

Jim Lin, TRIs VP of Sales and Marketing, commented: Teknosip has created a great educational platform for Brazilian market and we believe the seminar will open up many opportunities for TRI in South America as we bring our latest inspection and testing technologies on this market.