Gen3 Systems Limited, a specialist British manufacturer and distributor, sponsors the IPC Europe High-Reliability Forum, scheduled to take place Oct. 14-15, 2014 in Dsseldorf, Germany. Electrochemical corrosion, dendritic growth, conductive anodic filaments, BGA cracking and lead-free solder joint thermo-mechanical fatigue can all have negative impacts on the reliability and performance of todays high technology electronics. These are all critical reliability issues facing the European electronics designers and manufacturers. Gen3 Systems co-developed the two-day technical conference with top organisations including Airbus, Celestica, COM DEV, Continental Automotive, The European Space Agency, The National Physical Laboratory, Robert Bosch, Thales and Zestron. Leading experts from industry and research institutions will come together to explore these critical reliability issues and more facing European electronics designers and manufacturers.The day will consist of workshops and paper presentations covering the four key areas we face in our industry today: Electrochemical MigrationImpact of High Temperatures on Design, Process and Assembly Advanced PCB Materials and Technology Solder Joint ReliabilityFor more information and to register for this event, visit www.ipc.org/calendar/2014/EU-high-reliability/index.htm For more information about Gen3 Systems, visit www.gen3systems.com.