Company representatives will discuss Metcals full line of solder fume extractors and convection rework systems. Metcals advanced, versatile Array Package Rework systems offer the repeatability, accuracy and thermal control essential for the safe and effective rework of todays leading-edge BGA, CSP, LandGrip Array (LGA), micro SMD, Micro-lead Frame (MLF) and Bumped Chip Component packages.

Additionally, Metcal will highlight the MX-5200 Soldering, Desoldering and Rework Series. The MX-5200 Series offers the same increased productivity and process control as the MX-5000 Series with dual-simultaneous ports. The dynamic option enables the two hand-pieces to share 80 watts output power based on demand, adding even more application flexibility and speed.

For more information about Metcal, visit www.metcal.com.