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TRI携最新3D检测解决方案参加Electronica 2014展会
点击:1717来源: fbe-china.com作者:Kenny Fu
时间:2019-11-15 19:25:12

Test Research, Inc. (TRI) a leading test and inspection systems provider for the electronics manufacturing industry will introduce new PCBA test and inspection solutions at the upcoming Electronica 2014 exhibition. Visit us at booth A1 275 at Messe Mnchen from November 11 through 14 for a personal tour.

The highlights of TRIs 2014 portfolio will include two SPI systems: TR7007Q with high speed Stop-and-Go imaging for ultimate accuracy, ease of use and top inspection performance. TR7007 SII Plus brings highest inspection speed on the market at high resolution and with high accuracy. Both systems share easy to use operator GUI and powerful SPC analytics. TRIs key X-ray solution, TR7600 SII 3D Automated X-ray Inspection (AXI) will be shown with micro CT upgrade for the most demanding inspection applications. The inspection lineup will be complemented by industry leading 3D AOI, the TR7500 SIII 3D and the next generation of the worlds most powerful Tiny ICT, TR5001T SII TINY In-circuit Tester Commenting on this years lineup at Electronica, TRIs VP of Sales and Marketing Jim Lin commented, TRI focuses on delivering maximum value and savings to our customers by combining customized intelligent, integrated solutions with innovative technology and a worldwide support network. Our new solutions focus on bringing additional value and responding to different customer demands Discover how TRIs complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRIs systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at booth A1 275 for a personal tour of TRIs solution lineup.

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