Vi TECHNOLOGY, a leading provider of inspection solutions for SMT assembly, will exhibit in Booth 4C16 with its representative, Fenwick Iberica S.A., at Matelec 2014, scheduled to take place Oct. 28-31, 2014 at Ifema - Parque Ferial Juan Carlos I in Madrid, Spain. Company representatives will demonstrate the Pi SPI system and 2K Spectro for post-reflow.

Pi is innovative, intelligent and intuitive, and allows the customer to see and measure the print process like never before. With 360 Moir technology, Pi is the first SPI to use angle cameras to measure the solder paste deposit. Taking about 352 images per field of view, and thanks to the amazingly powerful computing system (100 times more computing power than conventional solutions), Pi provides an ultra large image in 3D true color. It offers a large PCB capability (up to 533 x 600mms) within a very small envelope (only 800mms wide), responding to the increasing constraints on floor space in modern SMD lines.

Vi TECHNOLOGYs 2K Spectro, with its effective footprint for PCB sizes not exceeding 14x14, is the smallest system of the Vi TECHNOLOGY K-Series. Vi TECHNOLOGY Spectro heads use an 8MP, 12-bit color camera to enhance the quality of images with lower resolution and higher definition. This new technology brings benefits to every stage of AOI usage including higher efficiency with effective cycle times, faster programming and a friendlier, intuitive interface for defect review.

For more information about Vi TECHNOLOGYs inspection solutions, visit www.vitechnology.com.