Speedline Technologies experts will tackle one of the SMT industryrsquo;s most critical manufacturing challenges in Asia ? the Lead Free Printing Process --in a free, live webinar on Thursday, 19, January, 2006. Designed for OEM and CEM process engineers, the one-hour Internet-based seminar will draw from expertise that Speedline Technologiesrsquo;engineers have acquired through its testing and printing of lead free solder pastes over nearly seven years. Their experience includes conducting formal designed experiments (DOE) and statistical studies on lead free solder paste printing, working with virtually all of the major solder paste suppliers, and close consultations with their own OEM and CEM customers. Throughout their efforts, the engineers have been evaluating the process performance characteristics of their tin lead and lead free solder pastes. The Web cast will begin at 2:00 p.m. Singapore Time. Specific areas of discussion will include: * Solder Paste Volume * Solder Paste Release form the Stencil * Stencil Design * Stencil Fabrication * Enclosed Print Heads * Printing Accuracy * A Questions Answers opportunity For more information, or to register, go to http://www.speedlinetech.com/seminars or call 65-6488 9103 in Asia. The event is the first in a new monthly series of free webinars hosted by Speedline Technologies. They are scheduled throughout 2006 as follows:  Thursday, 16 February, 2:00 p.m. Singapore Time: 0201 and 01005 Component Assembly Process  Thursday, 16 March, 2:00 p.m. Singapore Time: Lead Free Reflow Soldering  Thursday, 13 April, time to be announced: Adhesive Printing  Thursday, 18 May, time to be announced: Pin in Paste (Intrusive Reflow)  Thursday, 15 June, time to be announced: Lead Free Wave Soldering  Thursday, 13 July, time to be announced: Challenges of High Speed Underfill  Thursday, 17 August, time to be announced: Lead Free Printing Process  Thursday, 14 September, time to be announced: Practical DOE and SPC for Electronics Assembly  Thursday, 19 October, time to be announced: Cleaning Lead Free Residues  Thursday, 16 November, time to be announced: MicroDot Dispensing  Thursday, 14 December, time to be announced: 0201 and 01005 Component Assembly Process To register on the Web, visit: http://www.speedlinetech.com/seminarsor call 65-6488 9103 in Asia.