技术总在进步，但是是否发展的能满足消费者的需求呢？为对消费者的要求作出有效的和同步的回应，IPC联合Intel将于2007年5月23日在波特兰机场的度假宾馆举办我们向何方发展？我们需要发展到哪儿（Where are we going？Where do we need to be）技术研讨会。 During the forum, Intel will reveal its vision of the future and provide its requirements for the supply chain. Discussions will include the inevitable transition to HDI (high-density interface), the underlying challenges in making advancements in package scaling and associated board density, and activities to create pull for HDI PCBs from the OEM and ODM communities. Answering the call to action, nine of the industrys leading suppliers will explain the supply chains abilities, in areas from alternative alloys to underfill solutions, and will present area gap analyses. 欲了解更多研讨会信息或注册参加研讨会，请登陆网页： www.IPC.org/Intel2007 或联系Susan Filz, IPC行业项目经理，电话：+1 847-597-2884 ，邮箱：SusanFilz@ipc.org.