IPC宣布将在2007年6月8日在新加坡Grand Hyatt Singapore举办无铅研修班，内容包括无铅元器件（锡须问题），PCB（材料）以及装配（焊点可靠性）。 Lead-free regulations have been implemented since July 1, 2006 in the EU and March 1, 2007 in China. Recently, packages such as PBGA (plastic ball grid array), CSP (chip scale package) and WLCSP (wafer-level CSP) have been popular for consumer, computer, communication, military, automobile, medical, and mobile products. Most of these packages use solders as the interconnect and, as a result, are affected by lead-free regulations. In this course, some critical issues and their solutions of lead-free soldering (such as the latest EU and China regulations, cost, design, materials, forward- and backward-process incompatibility, inspections, tests, and reliability of components, PCBs, tin whiskers, and solder joints) will be presented. Emphasis is placed on the lead-free critical issues and solutions of the most popular SMT packages such as PQFP, PBGA, CSP and flip-chip WLCSP. Topics to be covered during the course include critical issues/solutions of SMT lead-free soldering; selecting/qualifying lead-free solder pastes; selecting/qualifying lead-free components; selecting/qualifying lead-free PCBs; Sn Whisker issues and how to reduce the reliability risk; key problems of the design, materials and processes of lead-free products; impact of X on Cu consumption and IMC of SnAgCu+X solder joints; impact of X on the material properties of SnAgCu+X; effects of voids on solder joints; key parameters impacting the lead-free solder joint reliability of products; how to avoid potential reliability problems due to lead-free soldering of products; choosing a cost-effective design for high-density electronics assemblies; establishing a high-yield lead-free SMT manufacturing process; and understanding the latest about EU RoHS and China RoHS. Most of the course materials are based on instructor John H. Laursquo;s recently published textbooks. Each participant will receive a comprehensive set of handout notes. Course content is recommended for component, packaging, design, material, process, equipment, reliability, product assurance, quality control, failure analysis, manufacturing, vendor, marketing, and sales engineers and managers. It is equally suited for RD engineers and scientists. The registration fee entitles participants to all course materials, refreshments and lunch on both days. Class size is limited, so please register by May 15, 2007. For more information, or if the registration deadline has passed, contact the IPC registration department at (847) 597-2861 or e-mail Nancy Feaster at NancyFeaster@ipc.org.