SMTA China宣布邀请业界人士参与其在8月21～23举办的SMTA China 南中国研讨会。这次研讨会将于NEPCON South China同时举行，内容涉及业界关注的电子组装、先进封装和无铅可靠性问题。 SMTA China is calling for technical papers as well as full- and half-day short courses. The abstract, author biography and PowerPoint presentation must be submitted in both English and Chinese, and will be included in the conference proceedings. All presentations must be made in Chinese. Topics of interest include 01005 assembly, 3-D SiP (System in Package), PoP (Package on Package), Lead-free Reliability, Component Supply Integrity, Legal Responsibility of Non-RoHS Parts/Products Entering Europe, Materials and Process Characterization, and Flex Circuit Assembly. The Technology Workshop will feature full- and half-day courses on 27 August; the Technology Conference will offer 30-minute technical papers on 28 August; and the Vendor Day Conference will feature 20-minute product technical papers from 28-31 August. If you or your company has pertinent information to share and you are looking for an opportunity to address an audience in China, contact Peggy Chen, executive administrator of SMTA China, at +86-21-5609-3010 or e-mail a short abstract to peggy@smta.org. Please include name, job title, company affiliation and all pertinent contact information. The deadline is 30 May 2007.