日前，IPC培训通知，计划在未来两个月内在上海进行四次培训认证课程，内容涉及电子组件的返工返修、可接受性以及PCB的验收等方面。

● 7711/21A―电子组件及印制板的返工、返修Rework and Repair Guide Everything you need to know for repair and rework of electronic assemblies and printed circuit boards! IPC-7711A, Rework of Electronic Assemblies (with Change 1) and IPC-7721A, Repair and Modification of Printed Boards and Electronic Assemblies (with Changes 1 and 2) now includes additional support for BGAs and flex-print repair. IPC-7711A includes procedural requirements, tools, materials and methods to be used in removing and replacing conformal coatings, surface mount and through-hole components. IPC-7721A includes procedures for repairing, modifying and reworking boards and assemblies. 具体认证课程内容和时间如下表：

● A-610D―电子组件的可接受性Acceptability of Electronic Assemblies IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include lead free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision D has over 730 new and updated illustrations of acceptability criteria and has been critically reviewed for clarity and accuracy.

● A-600G―印制电路板验收Acceptability of Printed Boards The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 80 new or revised photographs and illustrations, revision G provides new coverage on topics such as smear removal, lifted lands and wire bond pads along with updated and expanded coverage for measling and crazing of printed boards, annular ring requirements, etchback, foil cracks, flexible circuits, and minimum foil thickness for conductive patterns. The document sychronizes to the acceptability requirements expressed in IPC-6012B and IPC-6013A. 140 pages. Released July 2004. 详情请联系IPC上海Sally Cai （蔡向丽） Tel: 86-21-5497 3435 Fax: 86-21-5497 3437 E-mail: scai@ipc.org www.ipc.org / http://china.ipc.org