12月3日,IPC/JEDEC无铅电子国际研讨会?陶够嵩诘每巳斯州首府奥斯汀的德斯基酒店举行,焊料供应商NiHon Superior参与了此次会议. Nihon Superiorpresentation will take place on December 4, 2007 at 10:45 a.m. The paper, Impact Strength of Lead-Free BGA Spheres, will be presented by Keith Sweatman. Additionally, Nihon Superior will have a tabletop exhibition. A company representative will be available to discuss the companyproducts and technologies. With the RoHS directive in place, the demand for advice and solutions is increasing dramatically. The IPC and JEDEC are holding this international lead-free conference to give the electronics industry answers to the challenges of implementing lead-free processes.