12月17日,专业清洗产品供应商kyzen宣布该公司将参与2008年1月22日至24日在夏威夷举行的第13届年度泛太平洋微电子研讨会?陶够帷? Kyzen presentation will take place during Session WP4 in the Solder Assembly Challenges tract from 4 to 5:30 p.m. The paper, ;New Methods for Evaluating the Cleanliness Beneath Low Standoff Devices,; is authored by Michael Bixenman, Tom Forsythe and Ram Wissel, and will be presented by Tom Forsythe on Wednesday, January 23, 2008. The Pan Pacific Microelectronics Symposium Tabletop Exhibition promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world. Sponsored by the Surface Mount Technology Association (SMTA), the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.