IPC ―Association Connecting Electronics Industries has issued a Call for Participation for the Midwests premier technical conference, IPC Midwest Conference Exhibition. This yearrsquo;s event will take place September 23-28 at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit an abstract for the technical conference on any aspect of electronics manufacturing. Expert presentations are being sought in the areas of: eco-compliance ― REACH, halogen-free technology, RoHS; board design ― embedded passives, advances in CAD/CAM, fine pitch design; board materials ― new laminates, materials testing, high-frequency laminates; board fabrication ― advances in plating technology, advances in flex and rigid-flex, via formation and fill; and assembly technology ― solder joint reliability, rework and repair, high density assembly, and backward leaded/lead free compatibility. Abstracts must be submitted by April 11, 2008 and should include case histories, field data, and new technologies or innovations or research and findings. In addition, abstracts should summarize the problems and resolutions, methods used, results of experiments and benefits to the industry. Professional development courses will also be offered at IPC Midwest. Proposals are solicited from individuals interested in teaching full-day (six hours) or half-day (three hours) courses on design, or printed circuit board or electronic manufacturing processes and materials. Proposals including course descriptions must be submitted by April 11, 2008. For additional information on abstract and proposal submissions, visit www.IPCMidwestShow.org or contact Alexandra Curtis, IPC professional development manager, at +1 847-597-2877 or curtal@ipc.org.