AXI和返修系统供应商VJ Electronix日前宣布，在4月1－3日拉斯维加斯的APEX 2008上展出先进的返修工作站1800A。该公司展位号648. VJ Electronixs Summit 1800 Rework system provides some of the most advanced features designed specifically to address the most difficult rework challenges, including lead-free rework for large components and very small components. An increased 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets and connectors. The addition of programmable, motor-controlled top heater positioning in conjunction with the Summits independent pick-up motion provides the ultimate in process flexibility, make the Summit the number one choice for many contract manufacturers. The Summit 1800A adds a motor controlled board support table to the many standard benefits of the leading lead free rework system. The new table facilities automated, hands free solder removal. It also supports automated alignment and further reduces operator intervention. Various options are available for the Summit 1800A, which include component print station, cooling boost, sliding board support, and 22 x 30 board size upgrade. The Summit 1800A incorporates independent, programmable motions for both pick-up and top heater height. The pick-up motion allows precise placement force control and zero force removal. The component pick-up tube features 360 Theta control and automatic alignment height, ensuring proper focus and image magnification of components to be placed. Programmable heater position with automatic height sensing allows the nozzle to gasket the board with minimal force, or to be located at a pre-set gap above the board. For small component rework, VJ Electronix has added an 0201 and 01005 rework capability by using special tooling designed for rework of these passive components.An optional non-contact vacuum scavenging capability is also available in 2008 that includes dynamic height sensing for real time control of scavenger tip gap with the circuit board. VJ Electronixs Windows-based SierraMate 7.0 software improves on the Summits industry-proven simple operation and process control. New Advanced Auto Profile with rules-based process development allow process engineers to set specific constraints to be applied during automatic profile generation. This is a significant benefit for lead-free processes. An automatic prism shuttle designed to accommodate large components facilitates accurate and repeatable component alignment. The system simultaneously looks up at the component and down at the board, providing a composite alignment view. The digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a simple click on the graphical user interface. With standard board handling of 18 x 22, placement accuracy of 0.0005 to 0.001 and magnification capability from 2 to 40X, the Summit 1800A offers users numerous benefits, including advanced thermal data collection and analysis with trend capability, password-protected user accounts, and positive flow control for peak temperature protection of delicate components. Additionally, the system can rework the following applications: MCM, BGA, QFP, CPU sockets, vertical connectors, straddle mount connectors, passive components, microSMD, flip chip, microBGA and CSP.