SMTA日前宣布将在8月17－21日在佛罗里达州奥兰多的迪士尼科罗纳多温泉度假和会议中心举行的2008年国际会议上召开无铅焊接技术研讨会.做为已经连续举办8届的无铅研讨会,将有很多最先进的无铅技术和进展在此向业界公布. Organized by Dr. Paul T. Vianco of Sandia National Labs, the Lead-Free Soldering Technology Symposium will begin with a full session describing the latest consortium activities by the iNEMI group. Of particular interest will be a discussion of methodologies to evaluate the many new alloy compositions for different product applications. Sessions two and three are devoted to the very popular topic of case-studies. Six papers will describe the actual experiences of companies currently at the forefront of implementing a Pb-free solder solution for consumer and high-reliability products. Session four provides attendees with state-of-the-art information pertaining to Pb-free interconnection reliability. Specific course topics will range from the latest test data on the thermal cycling and shock testing of various alloy compositions and package designs, to forwards and backwards compatibility issues that remain as a significant concern for companies making high-reliability products. Attendees will find all of these presentations to be timely and extremely informative. For more information, contact Melissa Serres Marx, 952-920-7682, melissa@smta.org.