遵守RoHS要求，成功地实施无铅电子组装对电子互连行业是一个持续不断的挑战。为了帮助企业努力遵守这些目标， IPC和JEDEC将于2009年3约3日至5日在加利福尼亚圣克拉克市举办为期三天的无铅转换执行战略研讨会。 The event features a full-day technical conference on March 4. An outstanding roster of industry experts will cover such topics as: supply chain communication for a lead-free world, aerospace response to lead-free solder, lead-free implementation for SON and QFN devices, mitigation of corrosion-induced tin whiskers, and more. Flanking the technical conference are two days of half-day workshops on March 3 and 5. Workshop instructors will address lead-free soldering processes, lead-free systems performance and reliability, lead-free reliability in packaging and assembly, failure and root-cause analysis in lead-free electronics, managing lead-free transition and SMT in a lead-free world. Lead-free has impacted almost everyone in the electronics industry, from suppliers of components, boards and materials to manufacturers and users of electronic products and equipment, including the military and medical industry, says Jean Hebeisen, IPC director of professional development. Anyone in process, quality, manufacturing, design, purchasing, supply and management that wants to get a good understanding of the lead-free transition and how to successfully implement needs to attend this conference. JEDEC President John Kelly added, This joint conference provides a comprehensive and up-to-date compendium of information on the transition to lead free. As member-driven organizations, IPC and JEDEC believe its imperative to offer the industry real-world information on how companies are meeting the challenges of implementation. For more information on the conference or to register, contact Michelle Michelotti, IPC professional development coordinator, at +1 847-597-2822 or MichelleMichelotti@ipc.org.