Zestron日前宣布，将与11月11日下午五点在其马纳萨斯工厂举办SMTA的D.C.会议，Zestron的应用技术经理Umut Tosun将发表去离子水清洗的局限性主题演讲。 Recent market research studies have shown that DI-Water has clearly reached its limitations with regard to OA flux removal. As the electronics manufacturing industry is moving towards an increased use of lead-free solder pastes, DI-Water alone can no longer meet todays cleanliness requirements. Lead-free solder pastes require higher operating temperatures, which unfortunately result in more burnt-in fluxes and residues insoluble in water. They are difficult to remove with DI-Water only. Furthermore, due to its high surface tension of over 70 dynes/cm, DI-Water cannot effectively penetrate the space underneath low standoff components. The alternatives to DI-Water are aqueous-based chemistries that contain active ingredients and are usually diluted with DI-Water. This presentation will show that the use of chemistries in high precision cleaning processes will lead to better bonding and coating after cleaning, lower application temperatures, wider process windows and therefore an overall reduction in operating costs. Space is limited. Please register for this presentation by contacting Alfred Freire, SMTA D.C. Chapter, 410-747-1120, info@prodtecheast.com or www.smta.org/chapters.  For more information about ZESTRONs latest product technologies, services and complimentary product samples, please visit us online at www.zestron.com.