SEHO日前推出其最新型的双轨回流焊炉，该系列设备融入SEHO最新技术，一台回流焊炉同时可满足大小批量SMT焊接的需求。;The Dual Lane Reflow Oven features flexible production in parallel and is compatible for both lead-free and leaded SMT. The system reduces operating costs and saves floor space, with a 47 percent reduction in required floor space compared to traditional dual-lane production lines. The system contains two independent conveyor lanes and two heating areas. A total of 18 independently programmable heating zones, with both top and bottom side heating areas, ensuring maximum temperature profile flexibility. The conveyor speeds and widths are both independently controlled and adjustable. This latest generation system allows soldering of two different products with different thermal requirements side-by-side with only one reflow soldering system. The system also features Sehrsquo;s award winning LowMass conveyor technology and Tangential fan blower technology. For more information on SEHOrsquo;s Dual Lane Reflow Oven, visit www.sehona.com.