CALCE and IPC are sponsoring a technical seminar on May 24-25, 2011, at the University of Maryland, College Park campus. This seminar will provide attendees with a knowledge of the latest trends and technologies in electronics manufacturing. CALCE, IPC, and Members of the Jisso International Council, will also be speaking on reliability, prognostics, and three-dimensional interconnections. Topics will include: bull; Role of Prognostics and Health Management in Electronics bull; Total Packaging Solutions and JISSO Interconnection Levels bull; Electronics Materials Status - 2011 bull; Electronics Reliability Needs and Test Methods - 2011 bull; Solderless Interconnection bull; Printed Electronics bull; Environmentally Restricted Materials bull; Sustainability in Electronics Manufacturing Attendee will get a snapshot view of integrated electronics development and manufacturing, and will gail valuable knowledge on technologies that will impact the electronics industry over the next 10 years. If you want to gain a comprehensive understanding of the key issues in electronic interconnections, this seminar is a must. Potential Participants If you are interested in presenting at this seminar, please send title and abstract (maximum 500 words) to Joan Lee at joanyuan@calce.umd.edu . The deadline for submitting a presentation proposal is March 31, 2011. What is JIC? The purpose of the Jisso International Council is to facilitate, coordinate, and promote the orderly implementation of advanced electronic packaging and other advanced technologies by standardization and other means. The Council is supported by three main regional groups in each of three global hemispheres. These are the Jisso Japan Council (sponsored by JEITA, JPCA), the Jisso North American Council (sponsored by IPC, JEDEC, and iNEMI), and the Jisso European Council (sponsored by the EIPC).