Concord, California, USA - June 7, 2011 - Nordson MARCH, a leader in plasma processing technology, announces the global availability of the MaxVIA plasma treatment system that streamlines the printed circuit board (PCB) manufacturing process by quickly and uniformly treating a variety of panel sizes and types. The MaxVIA system provides high throughput and superior plasma uniformity in desmear and etchback applications for high density interconnect (HDI), flexible, and rigid circuit board manufacturing. The MaxVIA treatment system offers an expanded plasma chamber to accommodate large panel sizes of up to 24 x 42 inches and has a high throughput capacity of 92 to 138 units per hour (UPH), depending on panel size. The MaxVIA system utilizes 75% less volume of CF4 gas than competitive systems for desmear applications, thereby reducing the overall cost of ownership. The MaxVIA system sets a new industry bar for plasma treatment systems to handle a wide range of sizes and panel types while delivering superior uniformity at high-volume production rates, said Peter Bierhuis, president, Nordson MARCH.