BANNOCKBURN, Ill., USA, June 3, 2011 ?a IPC announces Summer Webinars for June, July and August 2011. Focused on critical, practical and social issues facing the electronics manufacturing industry, these sessions are based on award-winning technical papers from IPC APEX EXPO 2011. The one-hour webinars offer organizations cost-effective opportunities to bring important new information directly to their conference rooms.  The following webinars will run from 10:00 am to 11:00 am Central time: Assembly Guidelines for Pin in Paste Process Guhan Subbarayan, Ph.D., Cisco Assembly Sciences and Technology Team Wednesday, June 15, 2011 PCB Design and Assembly Process Planning for QFN and Other Bottom Termination Components  Vern Solberg, STC Madison Thursday, June 23, 2011 Conflict Metals: How This Issue Will Affect Your Business Tony Hilvers and Fern Abrams, IPC Monday, July 11, 2011  A New Method Measuring Conformal Coating Adhesion Chris Hunt, Ph. D., National Physical Laboratory (NPL) Wednesday, July 13, 2011 Cleaning Highly Dense Circuit Assemblies and Advanced Packages Mike Bixenman, DBA, Kyzen Corporation Tuesday, July 19, 2011  Printed Electronic (PE) Circuit Process for LED Interconnection Mike Dubois, Caledon Controls Wednesday, July 20, 2011 A New Approach for Early Detection of PCB Cratering Failures Anurag Bansal, Ph.D., Cisco Systems Wednesday, July 27, 2011 DFM ?a Design for Manufacturing Cheryl Tulkoff, DfR Solutions Wednesday, August 3, 2011 ITAR Compliance Basics and Cyber Security for Level 3 Manufacturers Bob Richardson and John Burton, TeamITAR Tuesday, August 9, 2011 Effects of Flux Residues on Reliability Eric Bastow, Indium Corporation Wednesday, August 10, 2011 The registration fee for each webinar is $75 per login for IPC members and $100 per login for nonmembers. An organization can stretch its staff development budget by training multiple employees in a conference room, equipped with a speakerphone and projector. For more information and to register, visit www.ipc.org/summer-webinars.  About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,900 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.