Herndon, VA ?a October 18, 2011 ?a The International Electronics Manufacturing Initiative (iNEMI) is a co-organizer of the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference in Taipei this week, and will hold a special forum as part of the Day Four conference program (Friday, October 21). The iNEMI forum, scheduled for 10:30 a.m. to 12:30 p.m. in Room 402A, will review the results and progress of several iNEMI projects: ?Consortial Approach to Advance Electronics Packaging,? Robert C. Pfahl, iNEMI ?Thermal Cycle Testing and Alloy Test Standards Development: An Update on the iNEMI Pb-Free Alloy Characterization Project,? Sze Pei Lim, Indium ?Investigation of Factors that Influence Creep Corrosion,? Cherie Chen, IST ?Technology Needs to Meet Increasing Wiring Density Requirements,? Mostafa Aghazadeh, Intel ABOUT iNEMI The International Electronics Manufacturing Initiative?ˉs mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. This industry-led consortium is made up of more than 95 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and RD initiatives. iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China; Limerick, Ireland; and Tokyo, Japan. For additional information about iNEMI, go to http://www.inemi.org