Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will display three new and advanced systems for part handling in Stand #B2.259 at the 20th international Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
The Small Part Handling Kit for Parts as Small as 200 Microns (TV1000-SP8-BD-220) is a general purpose vacuum handling tool that plugs directly into 220 Volt 50/60 Hz. This compact unit will handle a wide variety of optics, ball lenses and SMT parts used in the industry today. Parts as small as 0.008 (0.20mm) are handled without damage. Vacuum tweezers eliminate lost parts associated with mechanical tweezer handling. The long-life diaphragm vacuum pump generates up to 10of mercury with an open air flow of 2.3 lpm. The unit connects to ground automatically with a three-wire power cord.
Also on display, the WAFER-VAC system with 8 molded wafer tip (WV-9000-MW8-220) is a general purpose wafer vacuum handling tool that plugs directly into 110 Volt 50/60 Hz. This compact unit will handle a wide variety of wafers, solar cells and other substrates. The long-life diaphragm vacuum pump generates up to 10 of mercury with an open air flow of 2.3 lpm. The unit connects to ground automatically with a three-wire power cord.
The BULB-VAC with anti-wobble cone and 3/4ESD vacuum cup (BVJ-075-AW-ESD) is designed for enhanced functionality when handling INTEL LGA CPU products. This tool improves placement accuracy when picking processor chips from a shipping tray and placing into precision sockets. The BULB-VAC features an anti-wobble stiffener cone and a 3/4diameter ESD-safe conductive rubber silicone vacuum cup. It is designed to work only with a 3/4 diameter vacuum cup. Virtuals vacuum-bulb type tools are the lowest cost pick-and-place tools available.
For more information about any of Virtual Industries advanced equipment, stop by Stand #B2.259 at Productronica or visit www.virtual-ii.com.