Microtronic GmbH, a leading sales specialist of microelectronics announces that it will showcase its LBT-210 Solderability Tester in the LICO Stand #481, Hall A4 at the productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Microtronics LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets todays current industry challenges. The system is operated by using solder paste and a temperature profile. A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components. Additionally, the LBT-210 supports the established test methods using a solder bath and the test with a molten globule of solder.

Additionally, Microtronic will have staff on hand in the following suppliersbooths:

EVS ― Solder recovery systems (www.solderrecovery.com) Stand 141, Hall A4

AIM ― Specialty Solders (www.aimsolder.com) Stand 540, Hall A2

For more information, please speak with a Microtronic representative at productronica or visit www.microtronic.de.