Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, will exhibit at the upcoming ECTC, scheduled to take place May 28-30, 2013 at The Cosmopolitan in Las Vegas, NV.

Experts for 3D integration and sensor test will be available to discuss More than Moore and its implications for semiconductor and MEMS production. Advanced packaging and manufacturing processes target highest functionalities, speed and electrical performance of ICs and sensors at best cost. 3D integration  both with TSV and PoP  additionally supports the trend to minimum package sizes. For manufacturing, this implies new assembly processes and supply chain interdependencies. New risks and uncertainties and may cause significant reliability issues and financial troubles. On the MEMS side, integrated packages with multiple sensor types require smart test set-ups to ensure cost-efficient multi-DOF test. Which test equipment is the most appropriate one

How to deal with these uncertainties Which processes and equipment types have to be cautiously reviewed Is the established concept of Known Good Die really sufficient Will custom-tailored sensor test equipment allow for competitive cost of test

Multitest discussed new production and test strategies with various leading IC and sensor manufacturers. Based on more than 10 years in MEMS test, Multitest can offer standardized test equipment for up to 9 DOFs in on insertion. Leveraging the expertise of three decades in IC test, Multitest introduced new, unique equipment for in-process test of 3D packages: Multitest InStrip3D. The Instrip3D was qualified for production in summer 2012 for the first time and won Circuits Assembly magazines NPI Award in the category of Test  Inspection  Functional Test earlier this year.

James Quinn, VP Sales and Marketing, commented: For us, this award also recognizes Multitest to be the first equipment supplier to deliver a full turnkey hardware set up for in-process test in 3D assembly. Our unique product portfolio enables us to partner with our customers to develop comprehensive solutions for this emerging packaging technology that we see as a major strategic initiative in the semiconductor industry. With the initial challenges in wafer processes being addressed, the industry now faces the need to develop advanced test strategies. We are convinced that smart approaches for optimal test insertion points will make test a key differentiator.