Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, announces it has won the 2013 Global Technology Award in the stencils, stencil holders, and nano-coatings category for its NiCutX-SmartRelease stencils. The award recognizes the best new innovations in the printed circuit assembly and packaging industries.

NiCutX-SmartRelease stencils use an innovative technology that starts with Photo Stencils electroform stencil, applies a proprietary fiber-optic laser-cutting technology, and then embeds SmartRelease nano-coating. This combination produces superior stencil capabilities and print quality. The smooth aperture walls enable precise paste release while the SmartRelease coating dramatically reduces the need for under-screen cleaning on the printer, improving manufacturing speed and throughput. NiCutX-SmartRelease stencils perform well for applications with high density and mixed components and fine pitch components including ball grid arrays, quad flat no leads, and resistor networks.

We are honored that the industry recognizes our leadership role and the contribution of our products and technology to furthering the PCB industry, said Neil MacRaild, president of Photo Stencil.

The Global Technology Awards, sponsored by Global SMT Packaging magazine, were presented at the Productronica Trade Fair, Munich, Germany. Entries were judged on innovation, speed/throughput improvements, quality contribution, cost benefits, environmental consideration, ease of use/implementation, and maintainability/repairability.

For more information contact Photo Stencil at info@photostencil.com, call +1 719-304-4224, or visit the Photo Stencil website at www.photostencil.com.