FCT Assembly today announced that it will exhibit at the Ohio SMTA Expo Forum, scheduled to take place Thursday, July 17, 2014 at the Doubletree Cleveland Independence. Greg Smith, Regional Sales Manager and Technical Support, and Larry Roy of Enterprise Electronic Sales will be on site to answer any questions about FCTs stencils and its new coating technology. In addition to offering revolutionary stencil solutions, FCTs team has the knowledge to help build a custom solution that is unique to its customers processes.

Company representatives will demonstrate the NanoSlic Gold stencil the next generation of stencil technology developed to address the increasing demands confronting the electronic assembly industry. The NanoSlic Gold coating is based on a proprietary application process that coats both the underside of the stencil and aperture walls. This robust coating is both highly hydrophobic and oleophobic, which repels solder paste. NanoSlic Gold is thermally cured and is a permanent coating. The NanoSlic technology significantly improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. In addition, NanoSlic minimizes bridging and reduces underside cleaning. This technology can be easily evaluated and is compatible with current assembly equipment and processes.

Also on display, FCT Assemblys Step and Relief Stencils offer variable stencil thickness in specific areas to accommodate reduced volume (step down) or increased volume (step up). The stencils are ideal for controlling paste deposits on PCBs with both standard and fine-pitch SMT as well as intrusive reflow/paste-in-hole components. Steps are chemically etched into the squeegee side of the foil, yet all apertures are laser cut.

For more information, contact your local Fine Line Stencil representative or visit www.fctassembly.com.